An attack team performed a penetration test on a new smart card system. The team demonstrated that by subjecting the smart card to high temperatures, the secret key could be revealed.
Which of the following side-channel attacks did the team use?
An attack team performed a penetration test on a new smart card system. The team demonstrated that by subjecting the smart card to high temperatures, the secret key could be revealed.
Which of the following side-channel attacks did the team use?
The penetration testing team subjected the smart card to high temperatures to reveal the secret key, which aligns with a method known as Differential Fault Analysis (DFA). Differential Fault Analysis involves inducing faults through environmental stresses—such as temperature, voltage, or radiation—to observe how these faults affect the device's behavior and potentially reveal internal secrets like cryptographic keys. Differential Power Analysis, Differential Timing Analysis, and Differential Temperature Analysis do not directly involve the use of high temperatures to induce faults as described in the scenario.
"Differential fault analysis (DFA) is a type of active side-channel attack in the field of cryptography, specifically cryptanalysis. The principle is to induce faults—unexpected environmental conditions—into cryptographic operations, to reveal their internal states."
Differential temperature analysis is not a type of side-channel attack, but differential fault analysis is. Differential fault analysis involves subjecting the system to physical stresses, such as temperature, to reveal secret keys. B
Anser is B Read this article https://en.wikipedia.org/wiki/Differential_fault_analysis
What Alex said is to use the faulty device as an exploit.
B is the correct answer
C. Differential temperature analysis The attack described, where the secret key is revealed by subjecting the smart card to high temperatures, corresponds to a side-channel attack known as Differential Temperature Analysis. In this type of attack, the attacker exploits variations in temperature to gain information about the internal state of the cryptographic device, which may include the secret key. The other options represent different types of side-channel attacks: A. Differential Power Analysis (DPA) involves analyzing variations in power consumption. B. Differential Fault Analysis (DFA) involves inducing faults in the device to observe how they affect its behavior. D. Differential Timing Analysis involves analyzing variations in the time it takes for a cryptographic operation to complete. In the described scenario, the use of high temperatures to reveal the secret key aligns with Differential Temperature Analysis.
Power and clock glitch attacks on smart cards can help the attacker discover internal secrets or bypass security. An attacker can manipulate the temperature and supply voltage of the device, causing glitches. DFA = Fault Analysis Fault=Glitch Source: Verifying each answer against Chat GPT, my experience, other test banks, a written book, and weighing in the discussion from all users to create a 100% accurate guide for myself before I take the exam. (It isn't easy because of the time needed, but it is doing my diligence)
DFA involves inducing faults in a cryptographic device (such as a smart card) by applying various environmental stresses like high temperatures, voltage spikes, or radiation. The induced faults can cause errors in the cryptographic computations.
Going with B, my search found "Differential thermal analysis" not "Differential temperature analysis", and differences in temperature according to Wiki belonged to Fault analysis.
C: Differential temperature analysis (DTA) is a side-channel attack that involves measuring the temperature of a device to infer the values of its internal state and potentially recover secret keys.